DocumentCode :
413539
Title :
Dye-sensitized solar cells fabricated with novel polymeric solid electrolyte films
Author :
Asano, Tsuyoshi ; Uchida, Soichi ; Kubo, Takaya ; Nishikitani, Yoshinori
Author_Institution :
Central Tech. Res. Laboratory, Nippon Oil Corp., Yokohama, Japan
Volume :
1
fYear :
2003
fDate :
18-18 May 2003
Firstpage :
212
Abstract :
The performance of dye-sensitized solar cells (DSSCs) was studied by examining properties of the polymeric solid electrolyte (PSE) such as ionic conductivity, melting point, etc. Electrochemical reactions taking place inside the DSSCs were also closely studied using electrical impedance spectroscopy. The following three findings were obtained: 1) the short-circuit current density (Jsc) of a DSSC decreases with the PVDF-HFP-based polymer content of the PSE, chiefly due to the decrease in the diffusion coefficient of I/sub 3//sup -/; 2) we confirmed that a PSE/Pt interface was established as well as the electrolyte solution/Pt interface; and 3) the polymer content should be as low as possible in order to achieve a higher Jsc. The trade-off for decreasing the polymer content is the diminishment of the PSE tensile strength at high temperatures because the melting point of the PSE drops. Taking both factors into account, the preferable polymer content was found to be between 25 and 30 mass%. In this polymer content range, the Jsc of a PSE-based DSSC is about 80% that of a solution-based DSSC.
Keywords :
diffusion; dyes; electrochemical impedance spectroscopy; ionic conductivity; melting point; platinum; polymer electrolytes; short-circuit currents; solar cells; solid electrolytes; tensile strength; PSE/Pt interface; Pt; diffusion coefficient; dye-sensitized solar cell; electrical impedance spectroscopy; electrochemical reaction; electrolyte solution/Pt interface; ionic conductivity; melting point; polymer content; polymeric solid electrolyte film; short-circuit current density; tensile strength;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
Conference_Location :
Osaka, Japan
Print_ISBN :
4-9901816-0-3
Type :
conf
Filename :
1305259
Link To Document :
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