• DocumentCode
    413626
  • Title

    The science and applications of relaxed semiconductor alloys on conventional substrates

  • Author

    Fitzgerald, E.A. ; Groenart, M.E. ; Pitera, A. ; Lee, M.L. ; Yang, V. ; Carlin, J.A. ; Leitz, C.W. ; Andre, C.L. ; Ringel, S.A.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
  • Volume
    1
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    587
  • Abstract
    Progress in creating thin film relaxed lattice constant semiconductors on conventional substrates has recently led to progress in a variety of electronic and optoelectronic devices. By understanding the relationship between misfit and threading dislocations, and the relationship between dislocation nucleation and threading dislocation propagation, graded composition buffer layers can be used to relieve lattice mismatch and retain surface layers with great perfection. A particularly interesting system is the relaxed Si/sub 1-x/Ge/sub x//Si system, which can host a variety of high performance CMOS devices as well as allow for the integration of GaAs with Si. Optical links, solar cells, and more recently, continuous wave room temperature lasers have been created on GaAs/Ge/SiGe/Si. Commercialization of relaxed Si/sub 1-x/Ge/sub x//Si materials will likely occur through the Si CMOS end market, creating a supply of low cost SiGe virtual substrates for other application areas, including solar cells.
  • Keywords
    Ge-Si alloys; dislocations; elemental semiconductors; lattice constants; semiconductor thin films; silicon; solar cells; CMOS device; Si; Si/sub 1-x/Ge/sub x/-Si; continuous wave room temperature laser; conventional substrate; dislocation nucleation; dislocation propagation; graded composition buffer layer; lattice constant; optical link; optoelectronic device; relaxed semiconductor alloy; solar cell; threading dislocation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1305351