• DocumentCode
    413714
  • Title

    Fast and easy single step module assembly for back-contacted c-Si solar cells with conductive adhesives

  • Author

    Bultman, J.H. ; Eikelboom, D.W.K. ; Kinderman, R. ; Tip, A.C. ; Tool, C.J.J. ; van den Nieuwenhof, M.A.C.J. ; Schoofs, C. ; Schuurmans, F.M. ; Weeber, A.W.

  • Author_Institution
    ECN Solar Energy, Petten, Netherlands
  • Volume
    1
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    979
  • Abstract
    The simplest way to produce a module of crystalline silicon solar cells is with back-contacted cells that are glued on an interconnection foil using conductive adhesives. This foil also serves as environmental barrier at the rear of the module. The conductive adhesive is tuned to cure in the same cycle as the encapsulant. It is possible to interconnect the cells without any additional temperature curing in a single lamination step. The interconnection foil can be made for an acceptable cost price, as is shown in the paper. The savings in labor, a higher efficiency, and a yield increase will lead to a lower cost price for such a module. First results show that a module produced in a single step leads to similar fill factors as soldered modules.
  • Keywords
    elemental semiconductors; integrated circuit interconnections; silicon; solar cells; Si; back-contacted c-Si solar cell; conductive adhesive; efficiency; encapsulant; environmental barrier; fill factor; interconnection foil; single lamination step; single step module assembly;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1305447