• DocumentCode
    413735
  • Title

    Pure experimental determination of surface recombination properties with high reliability

  • Author

    Kampwerth, H. ; Rein, S. ; Glunz, S.W.

  • Author_Institution
    Fraunhofer ISE, Freiburg, Germany
  • Volume
    2
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    1073
  • Abstract
    A major task in developing new surface passivation layers for solar cells is their electrical characterization. A key value is the surface recombination velocity S. It can be extracted from the measured effective carrier lifetime /spl tau//sub eff/ in two ways: (1) with /spl tau//sub eff/ measured at one wafer and theoretical assumptions made for the bulk lifetime which leads to a major uncertainty in the S-determination. Or (2) with /spl tau//sub eff/ from a set of wafers with identically processed surfaces and different thicknesses W. Plotting /spl tau//sub eff/ in an 1//spl tau//sub eff/ vs. 1/W-diagram, the slope of a linear fit to the data equals 2S. The infeed grinder used in our study to prepare wafers with different thicknesses is an excellent tool to produce identical, planar surfaces with low damage depth and high reproducibility. Final damage-etching gives a perfect initial point for surface texture and passivation steps. By means of this technique S is determined for oxide-passivation surfaces on different doping concentrations.
  • Keywords
    boron; carrier lifetime; doping profiles; elemental semiconductors; etching; grinding; passivation; silicon; solar cells; surface recombination; surface texture; Si:B; carrier lifetime; damage etching; doping concentrations; electrical properties; infeed grinder; linear fit data; low damage depth; oxide passivation surfaces; planar surfaces; solar cells; surface passivation layer; surface recombination properties; surface recombination velocity; surface texture; wafer surface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1306098