• DocumentCode
    413803
  • Title

    The RTCVD160 - a new lab-type silicon CVD processor for silicon deposition on large area substrates

  • Author

    Reber, S. ; Haase, C. ; Schillinger, N. ; Bau, S. ; Hurrle, A.

  • Author_Institution
    Fraunhofer-Inst. fur Solare Energiesysteme, Freiburg, Germany
  • Volume
    2
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    1368
  • Abstract
    Fast and cost effective silicon deposition is a fundamental requirement for the preparation of crystalline silicon thin-film solar cells. Pursuing the high-temperature approach, chemical vapor deposition (CVD) of silicon layers by thermal decomposition of chlorosilanes is often applied. At Fraunhofer ISE we develop optically heated ("rapid thermal") RTCVD processors, where substrates are mounted in two parallel rows for deposition. In this paper we present a new RTCVD generation which is capable of depositing silicon on two rows of substrates, each up to 125/spl times/300 mm/sup 2/ in size. This RTCVD160 was specially designed for laboratory type purposes. The deposition process based on SiHCl/sub 3/, H/sub 2/, B/sub 2/H/sub 6/ and PH/sub 3/ is completely computer controlled. The optical heating system enables fast temperature ramps and stable process temperatures up to 1300/spl deg/C. Epitaxial growth rates exceeding 5 /spl mu/m/min can be reached with this system.
  • Keywords
    chemical vapour deposition; elemental semiconductors; pyrolysis; rapid thermal processing; semiconductor growth; semiconductor thin films; silicon; solar cells; Fraunhofer indentation size effect; RTCVD160; Si; SiO/sub 2/; chlorosilanes; computer controlled process; crystalline silicon thin film solar cell; epitaxial growth rates; optical heating system; rapid thermal chemical vapor deposition processors; silicon CVD processor; silicon chemical vapour deposition processor; silicon deposition; temperature ramp; thermal decomposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1306176