DocumentCode :
413844
Title :
Poly-Si cells at a deposition rate of more than 1 nm/s by hot-wire chemical vapour deposition
Author :
Rath, J.K. ; Hardeman, A.J. ; van der Werf, C.H.M. ; van Veenendaal, P.A.T.T. ; Rusche, M.Y.S. ; Schropp, R.E.I.
Author_Institution :
Phys. of Devices, Utrecht Univ., Netherlands
Volume :
2
fYear :
2003
fDate :
18-18 May 2003
Firstpage :
1562
Abstract :
High silane to hydrogen flow ratios and optimum filament temperatures are the key process parameters to achieve high growth rate poly-silicon films by hot wire CVD deposition using a four-wire assembly. Growth rates up to 7 nm/s have been achieved. The process conditions to incorporate high hydrogen content into the material for passivation of defects and donor states have been identified as high hydrogen dilution and lower filament temperature. Films deposited at 1.3 nm/s showed high ambipolar diffusion length of 132 nm. Incorporating such poly-Si films as i-layer, n-i-p solar cell on stainless steel substrate without back reflector showed an efficiency of 4.4% and a high open circuit voltage of 0.58V.
Keywords :
carrier lifetime; chemical vapour deposition; elemental semiconductors; impurity states; passivation; semiconductor growth; semiconductor thin films; silicon; solar cells; 0.58 V; 132 nm; CVD; Si; ambipolar diffusion length; back reflector; defects state; donor state; filament temperature; four wire assembly; hot wire chemical vapour deposition; hydrogen dilution; hydrogen flow; n-i-p solar cell; open circuit voltage; optimum filament temperatures; passivation; polycrystalline silicon films; polycrystalline silicon solar cell; stainless steel substrate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
Conference_Location :
Osaka, Japan
Print_ISBN :
4-9901816-0-3
Type :
conf
Filename :
1306225
Link To Document :
بازگشت