• DocumentCode
    413876
  • Title

    Wide gap and low resistive hetero-structured SiC/sub X/ films for wide gap window of heterojunction solar cells

  • Author

    Itoh, Takashi ; Hasegawa, Yuki ; Fujiwara, Takao ; Masuda, Ayako ; Nonomura, Shuichi

  • Author_Institution
    Dept. of Electr. Eng., Gifu Univ., Japan
  • Volume
    2
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    1706
  • Abstract
    The dependence of the properties of on the distance between the filament and the substrate in hetero-structured silicon carbon alloy (SiC/sub X/) films deposited with various deposition conditions by hot-wire CVD (Cat-CVD) has been studied. Based on above results, the B-doped hetero-structured SiC/sub X/ films have been deposited with a low film surface temperature, T/sub s/, condition. The optical energy gap in the low T/sub s/ sample was almost same as that of the high T/sub s/ sample, although the carbon content of the low T/sub s/ sample was smaller than that of the high T/sub s/ sample. The dark conductivity of the sample deposited with B/sub 2/H/sub 6//SiH/sub 4/ of 0.3% was 1.05/spl times/10/sup -1/ S/cm. This value was much larger than that of the high T/sub s/ sample deposited with B/sub 2/H/sub 6//SiH/sub 4/ of 0.42%.
  • Keywords
    Raman spectra; amorphous semiconductors; boron; chemical vapour deposition; dark conductivity; electrical resistivity; energy gap; optical constants; semiconductor growth; semiconductor heterojunctions; semiconductor thin films; silicon compounds; solar cells; wide band gap semiconductors; B-doped heterostructured SiC/sub X/ films; Raman spectra; SiC:B; carbon content; dark conductivity; electrical resistivity; heterojunction solar cells; hot wire CVD; low resistive heterostructured SiC/sub X/ films; optical energy gap; silicon carbon films; surface temperature; wide gap heterostructured SiC/sub X/ films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1306260