• DocumentCode
    413938
  • Title

    Climatic impact on the efficiency of a copper indium diselenide module

  • Author

    Durisch, Wilhelm ; Kiess, Helmut ; Lam, King-hang ; Close, Josie

  • Author_Institution
    Paul Scherrer Inst., Villigen, Switzerland
  • Volume
    2
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    1968
  • Abstract
    The experiments investigate the influence of climatic parameters on the efficiency of a commercially available copper indium diselenide (CIS) module. The results allowed to develop a five-parameter model describing the efficiency as a function of irradiance, cell temperature and relative air mass. The model is indispensable to determine accurately the yearly output of CIS modules at different sites with given meteorology. Two quantities were calculated from the model as by-products, namely the cell efficiency at standard test conditions (STC) and the temperature coefficient of the cell efficiency at STC, being 11.6% and -0.050 abs.%//spl deg/C, respectively. The efficiency decreases linearly with cell temperature. However, the decrease is less pronounced than with crystalline silicon modules. The efficiency of the module is practically independent on air mass. This is in contrast to amorphous silicon modules as well as micro-morphous tandem and amorphous triple- junction silicon modules, which show a decrease in efficiency in the late afternoon due to the increasing air mass and a simultaneous red shift of the solar spectrum.
  • Keywords
    copper compounds; elemental semiconductors; indium compounds; semiconductor device models; solar cells; ternary semiconductors; CuInSe/sub 2/; cell efficiency; climatic impact; copper indium diselenide module; crystalline silicon module; five parameter model; irradiance; meteorology; relative air mass; standard test condition; temperature coefficient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1306329