Exploring the limits of high temperature thermal processing for advanced 8-inch power technology manufacturing

Author

Rupp, T. ; Dyroff, N. ; Gaertner, T. ; Gross, T. ; Gruber, H. ; Neidhart, T. ; Peri, H. ; Riss, J. ; Schagerl, G. ; Stefaner, A. ; Sorschag, K. ; Danzfuss, B. ; Domes, H. ; Gatterbauer, J. ; Geiger, H. ; Kaspar, J. ; Komposch, A. ; Leicht, M. ; Mayer, B.

Author_Institution

Infineon Technol. AG, Villach, Austria

fYear

2004

fDate

4-6 May 2004

Firstpage

27

Lastpage

31

Abstract

Power processes are a challenge for 8-inch production especially in thermal processing. The temperatures exceed those used in DRAM and LOGIC by far and make a detailed knowledge of the critical process limits and maximum temperatures mandatory. We describe the experimental evaluation of these limits and compare the results to theoretical models, for both horizontal and vertical furnace equipment. Bulk micro defects are shown to be a key factor for any thermal process. We investigate in detail the key parameters for the different process regimes of boat push/pull, ramping as well as the impact of different boat and furnace equipment.

Keywords

DRAM chips; X-ray topography; electric furnaces; elemental semiconductors; rapid thermal processing; semiconductor thin films; silicon; thermal stresses; DRAM; LOGIC; Si; furnace; high temperature thermal processing; micro defects; power technology manufacturing; Boats; Furnaces; Manufacturing processes; Production; Random access memory; Semiconductor device modeling; Surfaces; Temperature; Thermal factors; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Print_ISBN

0-7803-8312-5

Type

conf

DOI

10.1109/ASMC.2004.1309529

Filename

1309529