DocumentCode
414467
Title
Extending the capability of 0.60 NA DUV stepper for contact hole lithography of 140 nm node DRAM technology
Author
Staub, R. ; Pforr, R. ; Hennig, M. ; Thielscher, G. ; Handke, M. ; Hofman, Daniel
Author_Institution
Infineon Technol. Dresden GmbH & Co OHG, Germany
fYear
2004
fDate
4-6 May 2004
Firstpage
79
Lastpage
83
Abstract
We present a project where DUV Steppers have been successfully implemented as standard lithography tool for a critical contact layer on 140 nm node technology under running production conditions. The utilisation of older generation lithography tools has been possible by using alternating phase shift masks (altPSM). Since the altPSM offers a much wider process window compared to half tone phase shift masks (HTPSM), lithography of contact holes could be transferred from 248 nm DUV Scanner to 0.6 NA DUV stepper. Methods are described how the problems caused by worse lens aberration performance of older generation lithography tools could be overcome and the successfull implementation of the altPSM lithography into the production process could be achieved.
Keywords
DRAM chips; phase shifting masks; ultraviolet lithography; 140 nm; 248 nm; DRAM technology; DUV scanner; DUV stepper; alternating phase shift masks; contact hole lithography; half tone phase shift masks; lens aberration; process window; production process; Contacts; Continuous production; Costs; Lenses; Lithography; Manufacturing processes; Phased arrays; Printing; Random access memory; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309540
Filename
1309540
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