DocumentCode
414470
Title
Real-time detection of resist strip failure at metal etch process equipment
Author
Cha, Sang-Yeob ; Lee, Hyeokjae ; Chae, Seung-Ki
Author_Institution
Fab Equipment Technol. Group, Samsung Electron. Co., Ltd., Gyeonggi, South Korea
fYear
2004
fDate
4-6 May 2004
Firstpage
217
Lastpage
220
Abstract
Metal etch process is to form the electrical metal lines of device on a wafer. DPS of AMAT, the one of metal etch process equipments, is assembled chambers for metal etch process and resist strip process. The wafer proceeds metal etch process and resist strip process continuously. If resist were not removed clearly in the strip process chamber, its ash induces serious defect to metal lines. Despite such a failure has been randomly occurred in resist strip chamber, real-time detection of it was impossible under interlock system by using classical SPC. This paper shows how it is possible to detect resist strip failure in real-time by modeling. As a result, wafer loss by resist ash could be decreased effectively in the metal etch process.
Keywords
etching; failure analysis; fault diagnosis; resists; semiconductor device manufacture; electrical metal line; metal etch process; metal etch process equipment; real time detection; resist strip failure analysis; strip process chamber; wafer loss; Ash; Condition monitoring; Etching; Fault detection; Real time systems; Resists; Semiconductor device modeling; Strips; Temperature sensors; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309569
Filename
1309569
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