• DocumentCode
    414479
  • Title

    Surface enhanced Raman spectroscopy for non-destructive analysis of surfaces following excimer laser removal of polyimide

  • Author

    Gao, Shubo ; Holmes, Andrew S.

  • Author_Institution
    Electr. & Electron. Eng. Dept., Imperial Coll. London, UK
  • fYear
    2004
  • fDate
    4-6 May 2004
  • Firstpage
    487
  • Lastpage
    491
  • Abstract
    In this study, surface enhanced Raman spectroscopy (SERS) has been investigated as a nondestructive technique for monitoring the cleanliness of gold surfaces following KrF excimer laser removal of ∼2 μm-thick polyimide films. 1360 cm-1 (D line) and 1580 cm-1 (G line) carbon sensitive bands were detected in the Raman spectra of samples cleaned with up to 100 laser pulses at fluences in the range 120-140 mJ/cm2. The Raman intensity ratio ID/IG increased with the number of pulses, indicating that graphite-like carbon residues were being broken down into smaller fragments with prolonged exposure. The same two carbon peaks disappeared from the Raman spectra of samples subjected to further cleaning, indicating complete removal of carbon residues from the surface. The results show that SERS is a useful in-situ, non-destructive technique for monitoring polyimide laser ablation and cleaning processes.
  • Keywords
    gold; laser ablation; nondestructive testing; polymer films; surface cleaning; surface enhanced Raman scattering; surface morphology; 1360 cm-1; 1580 cm-1; 2 micron; Au; Raman intensity ratio; carbon sensitive bands; cleaning process; excimer laser removal; gold surface cleanliness monitoring; graphite like carbon residue; nondestructive analysis; polyimide films; polyimide laser ablation; surface enhanced Raman spectroscopy; Cleaning; Laser ablation; Micromechanical devices; Monitoring; Polyimides; Raman scattering; Rough surfaces; Spectroscopy; Surface emitting lasers; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
  • Print_ISBN
    0-7803-8312-5
  • Type

    conf

  • DOI
    10.1109/ASMC.2004.1309620
  • Filename
    1309620