Title :
Evaluation of Atomic Layer Stacking Structure and Curie Temperature of Magnetic Films for Thermally Assisted Recording Media (Invited)
Author :
Saito, Sakuyoshi ; Hinata, Shintaro ; Takahashi, Masaharu
Author_Institution :
Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan
Abstract :
Thermally assisted recording system is a promising candidate to overcome the trilemma of perpendicular magnetic recording hard disk drive development. In this paper, we introduce our current research about evaluation for the media material. In-plane X-ray diffraction technique is effective to evaluate atomic layer stacking structure of (111)-oriented face-centered cubic, c-plane-oriented hexagonal closed packed (hcp), and their intermediate structure with stacking faults of CoPt alloy thin film. Analytical results of Co50Pt50-based thin film shows that changing the valence electron number closer to 9 can effectively reduce the stacking fault. In practical, perfect hcp atomic layer stacking can be achieved by substituting Pt (group 10) with Rh (group 9). High-angle annular dark field of scanning transmission electron microscopy with probe diameter of 1 Å can effectively observe composition modulated atomic layer stacking with the super-lattice diffraction in Co-based alloy films. In practical, for Co80M20 (M: Ir, Pt) thin film sputtered under high substrate temperature, the irregular or alternately layered structure of M rich and M poor layer can be observed directly. To evaluate Curie temperature (TC), which is an important physical property of thermally assisted media, conduction electron spin-dependent scattering should be the focus. Fitting dielectric spectra for MnSb thin film with TC ~ 320°C measured with the ellipsometry and analyzing the Drude´s term, temperature dependence of resistivity and scattering time at around TC was confirmed.
Keywords :
Curie temperature; X-ray diffraction; antimony alloys; cobalt alloys; ellipsometry; iridium alloys; magnetic recording; magnetic thin films; manganese alloys; metallic thin films; platinum alloys; scanning-transmission electron microscopy; stacking faults; (111)-oriented face-centered cubic structure; Co80Ir20; Co80Pt20; CoPt alloy thin film; Curie temperature; Drude term; MnSb; atomic layer stacking structure; c-plane-oriented hexagonal closed packed structure; conduction electron spin-dependent scattering; dielectric spectra; ellipsometry; high-angle annular dark field; in-plane X-ray diffraction technique; magnetic films; resistivity; scanning transmission electron microscopy; size 1 angstrom; stacking faults; substrate temperature; super-lattice diffraction; temperature dependence; thermally assisted recording media; valence electron number; Atomic layer deposition; Diffraction; Magnetic recording; Materials; Metals; Stacking; Temperature measurement; Dielectric spectrum; grazing-incidence in-plane X-ray diffraction (XRD); stacking faults; super-lattice diffraction;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2013.2285286