Title :
Add-on process modules - an economic enhancement for high-frequency silicon technology
Author :
Burghartz, Joachim N.
Author_Institution :
Dept. EWI, TU Delft, Netherlands
Abstract :
Add-on process modules as enhancements for standard high-frequency silicon integration processes are discussed. Such modules can be added without any interference with the core process before (pre-process modules), during (mid-process modules), or after (post-process modules) the circuit integration. High-resistivity silicon substrates, bulk micromachining, and Saddle-Add-on Metallization (SAM) are presented as examples in those categories.
Keywords :
elemental semiconductors; metallisation; micromachining; micromechanical devices; process design; silicon; Saddle-Add-on Metallization; add-on process modules; bulk micromachining; circuit integration; economic enhancement; high-frequency Si technology; Baseband; CMOS technology; Circuits; Fabrication; Gallium arsenide; Isolation technology; Radio frequency; Silicon; Substrates; Transceivers;
Conference_Titel :
Microelectronics, 2004. 24th International Conference on
Print_ISBN :
0-7803-8166-1
DOI :
10.1109/ICMEL.2004.1314563
