• DocumentCode
    415639
  • Title

    Thermal Laser Stimulation of active devices in silicon - a quantitative FET parameter investigation

  • Author

    Boit, Christian ; Glowacki, Arkadiusz ; Brahma, Sanjib Kumar ; Wirth, Kristin

  • Author_Institution
    Berlin Univ. of Technol., Germany
  • fYear
    2004
  • fDate
    25-29 April 2004
  • Firstpage
    357
  • Lastpage
    360
  • Abstract
    Thermal Laser Stimulation (TLS) can localize also silicon device anomalies using free carrier absorption in heavily doped areas. We present frontside and backside results on the quantitative influence of TLS on FET parameters. We show how the FET output curve shifts as function of laser power and scanning speed. This work investigates the quantitative influence of frontside and backside TLS on FET device parameters. The influence of temperature on device characteristics has been investigated in detail and used as standard. As a result, the TLS temperature shift can be calculated and the correlating device parameters can be obtained. Based on this study, the detectability of defects with TLS or SDL can be estimated much more accurate.
  • Keywords
    carrier mobility; failure analysis; field effect transistors; measurement by laser beam; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; Si devices; backside; device parameters; free carrier absorption; frontside; heavily doped areas; output curve shifts; quantitative FET parameter investigation; thermal laser stimulation; Absorption; BiCMOS integrated circuits; Conductivity; FETs; Failure analysis; Integrated circuit interconnections; Optical beams; Silicon devices; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
  • Print_ISBN
    0-7803-8315-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.2004.1315352
  • Filename
    1315352