DocumentCode :
415646
Title :
Cause of erase speed degradation during two-bit per cell operation of a trapping nitride storage flash memory cell
Author :
Tsai, W.J. ; Zous, N.K. ; Chou, M.H. ; Huang, Smile ; Chen, H.Y. ; Yeh, Y.H. ; Liu, M.Y. ; Yeh, C.C. ; Wang, T. ; Ku, Joseph ; Lu, Chih-Yuan
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
522
Lastpage :
526
Abstract :
Erase speed degradation in a dual-bit, trapping nitride storage flash memory cell is investigated. Our study shows that the trapped-electron area of the second-programmed bit would extend more toward the central channel region if its neighboring bit (of the same cell) has been programmed. The second bit would then be erased slower. This effect gets more obvious after program/erase cycling. In addition, the erase speed would be modulated by adjacent junction biases in a short-channel, nearly punch-through cell.
Keywords :
flash memories; semiconductor device breakdown; semiconductor device reliability; central channel region; erase speed degradation; nearly punch-through cell; program/erase cycling; second-programmed bit; trapped-electron area; trapping nitride storage flash memory cell; two-bit per cell operation; Channel hot electron injection; Degradation; Dielectrics; Electron traps; Flash memory; Flash memory cells; Hot carriers; MOSFETs; SONOS devices; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315383
Filename :
1315383
Link To Document :
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