• DocumentCode
    415646
  • Title

    Cause of erase speed degradation during two-bit per cell operation of a trapping nitride storage flash memory cell

  • Author

    Tsai, W.J. ; Zous, N.K. ; Chou, M.H. ; Huang, Smile ; Chen, H.Y. ; Yeh, Y.H. ; Liu, M.Y. ; Yeh, C.C. ; Wang, T. ; Ku, Joseph ; Lu, Chih-Yuan

  • Author_Institution
    Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2004
  • fDate
    25-29 April 2004
  • Firstpage
    522
  • Lastpage
    526
  • Abstract
    Erase speed degradation in a dual-bit, trapping nitride storage flash memory cell is investigated. Our study shows that the trapped-electron area of the second-programmed bit would extend more toward the central channel region if its neighboring bit (of the same cell) has been programmed. The second bit would then be erased slower. This effect gets more obvious after program/erase cycling. In addition, the erase speed would be modulated by adjacent junction biases in a short-channel, nearly punch-through cell.
  • Keywords
    flash memories; semiconductor device breakdown; semiconductor device reliability; central channel region; erase speed degradation; nearly punch-through cell; program/erase cycling; second-programmed bit; trapped-electron area; trapping nitride storage flash memory cell; two-bit per cell operation; Channel hot electron injection; Degradation; Dielectrics; Electron traps; Flash memory; Flash memory cells; Hot carriers; MOSFETs; SONOS devices; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
  • Print_ISBN
    0-7803-8315-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.2004.1315383
  • Filename
    1315383