DocumentCode
415646
Title
Cause of erase speed degradation during two-bit per cell operation of a trapping nitride storage flash memory cell
Author
Tsai, W.J. ; Zous, N.K. ; Chou, M.H. ; Huang, Smile ; Chen, H.Y. ; Yeh, Y.H. ; Liu, M.Y. ; Yeh, C.C. ; Wang, T. ; Ku, Joseph ; Lu, Chih-Yuan
Author_Institution
Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2004
fDate
25-29 April 2004
Firstpage
522
Lastpage
526
Abstract
Erase speed degradation in a dual-bit, trapping nitride storage flash memory cell is investigated. Our study shows that the trapped-electron area of the second-programmed bit would extend more toward the central channel region if its neighboring bit (of the same cell) has been programmed. The second bit would then be erased slower. This effect gets more obvious after program/erase cycling. In addition, the erase speed would be modulated by adjacent junction biases in a short-channel, nearly punch-through cell.
Keywords
flash memories; semiconductor device breakdown; semiconductor device reliability; central channel region; erase speed degradation; nearly punch-through cell; program/erase cycling; second-programmed bit; trapped-electron area; trapping nitride storage flash memory cell; two-bit per cell operation; Channel hot electron injection; Degradation; Dielectrics; Electron traps; Flash memory; Flash memory cells; Hot carriers; MOSFETs; SONOS devices; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN
0-7803-8315-X
Type
conf
DOI
10.1109/RELPHY.2004.1315383
Filename
1315383
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