DocumentCode :
415652
Title :
Comparison of ultra-thin gate oxide ESD protection capability of silicided and silicide-blocked MOSFETS
Author :
Lee, J.H. ; Shih, J.R. ; Yu, K.F. ; Wu, Y.A. ; Ong, T.C.
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
609
Lastpage :
610
Abstract :
In this paper, ultra-thin oxide ESD protection capability of silicided and silicide-blocked MOSFETs is studied. We find that ground Gate NMOSFETs (GGNMOS) with silicided drain can provide much better ultra-thin oxide ESD protection capability than the GGNMOS with silicide-blocked drain, and oxide damage is occurred at the transient before the device occurring the snapback. Because the device under the TLP and ESD has different discharge behaviors at the transient before the snapback, it results in that TLP test result does not correlate to ESD test result.
Keywords :
CMOS integrated circuits; MOSFET; dielectric thin films; electrostatic discharge; integrated circuit reliability; semiconductor device breakdown; semiconductor device reliability; ground gate NMOSFETs; silicide-blocked MOSFETS; silicided MOSFET; snapback; ultra-thin gate oxide ESD protection capability; Breakdown voltage; Capacitance; Capacitors; Circuit testing; Electrostatic discharge; MOS devices; MOSFETs; Protection; Silicides; Variable structure systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315413
Filename :
1315413
Link To Document :
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