Title :
Effect of thermal gradients on the electromigration life-time in power electronics
Author :
Nguyen, H.V. ; Salm, C. ; Krabbenborg, B. ; Weide-Zaage, K. ; Bisschop, J. ; Mouthaan, A.J. ; Kuper, F.G.
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
Keywords :
electromigration; integrated circuit metallisation; integrated circuit reliability; power electronics; thermoelectricity; electromigration life-time; electromigration-induced failures; power electronics; temperature gradient; thermal gradients; thermomigration; Current density; Diodes; Electromigration; Failure analysis; Heating; Laboratories; Microstructure; Ovens; Temperature sensors; Testing;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315418
