DocumentCode
415655
Title
Effect of thermal gradients on the electromigration life-time in power electronics
Author
Nguyen, H.V. ; Salm, C. ; Krabbenborg, B. ; Weide-Zaage, K. ; Bisschop, J. ; Mouthaan, A.J. ; Kuper, F.G.
Author_Institution
MESA Res. Inst., Twente Univ., Enschede, Netherlands
fYear
2004
fDate
25-29 April 2004
Firstpage
619
Lastpage
620
Abstract
The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
Keywords
electromigration; integrated circuit metallisation; integrated circuit reliability; power electronics; thermoelectricity; electromigration life-time; electromigration-induced failures; power electronics; temperature gradient; thermal gradients; thermomigration; Current density; Diodes; Electromigration; Failure analysis; Heating; Laboratories; Microstructure; Ovens; Temperature sensors; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN
0-7803-8315-X
Type
conf
DOI
10.1109/RELPHY.2004.1315418
Filename
1315418
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