DocumentCode :
415673
Title :
Diamond studded traveling wave tube
Author :
Dayton, J.A. ; Mearini, G.T. ; Chen, H. ; Kory, C.L.
Author_Institution :
GENVAC Aerosp. Corp, Cleveland, OH, USA
fYear :
2004
fDate :
27-29 April 2004
Firstpage :
84
Lastpage :
85
Abstract :
Summary form only given.. A novel method of mm wave traveling wave tube (TWT) slow wave circuit fabrication, employing laser micromachining and the in situ growth of diamond studs as an insulating dielectric, is being developed, which would enable a new class of very wideband, low distortion, high efficiency amplifiers. Because the slow wave circuit is supported by an array of diamond studs, rather than the conventional dielectric rods, we have named this novel device the diamond studded TWT. Three innovations not typically employed in the tube industry are being introduced in this development. First, the conventional dielectric support rods are replaced with CVD diamond. Second, the conventional process of winding the helix results in a distortion in the rectangular cross section of the helix tape; this effect is eliminated by micromachining. Third, the circuit is brazed, eliminating the need for large compressive forces to maintain thermal conductivity.
Keywords :
brazing; chemical vapour deposition; diamond; elemental semiconductors; laser beam machining; micromachining; millimetre wave tubes; slow wave structures; thermal conductivity; wideband amplifiers; C; CVD diamond; brazing; diamond stud in situ growth; diamond studded traveling wave tube; insulating dielectric support rods; laser micromachining; low distortion high efficiency amplifiers; micromachined helix; mm wave TWT; slow wave circuit fabrication; thermal conductivity; wideband amplifiers; Broadband amplifiers; Circuits; Dielectric devices; Dielectrics and electrical insulation; Laser noise; Micromachining; Optical device fabrication; Technological innovation; Thermal conductivity; Thermal force;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Electronics Conference, 2004. IVEC 2004. Fifth IEEE International
Print_ISBN :
0-7803-8261-7
Type :
conf
DOI :
10.1109/IVELEC.2004.1316210
Filename :
1316210
Link To Document :
بازگشت