High heat flux and high density cooling: Its all relative

This presentation gives a brief perspective on the cooling challenges that manufacturers and their customers facing at the chip level, box level, rack level and data center level. In particular, the goal of the discussion is to demonstrate that high density packaging is not a problem that is unique to chip level cooling but rather the whole value chain (from chip level to data center level). In each of these cases, some opportunities are discussed and some examples are given of what manufacturers are doing to manage these local density issues. By no means is this discussion to be a comprehensive but rather to stimulate discussion in the forum.