Packaging image sensor devices for camera module applications

Author

Darveaux, Robert ; Chowdhury, Asif ; Tome, Jay ; Schoonejongen, Ron ; Reifel, Mitch ; De Guzman, Archie ; Park, Sung Soon

Author_Institution

Amkor Technol. Inc., Chandler, AZ, USA

fYear

2004

fDate

1-4 June 2004

Firstpage

18

Abstract

Production of image sensor devices has increased dramatically in recent years due to wide scale adoption of camera modules in mobile phones. It is expected that over 150M camera modules will be shipped in mobile phones in 2004. The packaging of an image sensor in a camera module presents several unique engineering challenges. Materials selection, assembly process, optical test, and facilities control are all areas where technology is rapidly developing. This paper focuses on current challenges, and highlights several areas where advances in research and development are needed.

Keywords

cameras; image sensors; mobile handsets; modules; packaging; 150M camera modules; assembly process; camera module applications; facilities control; materials selection; mobile phones; optical test; packaging image sensor devices; Assembly; Cameras; Image sensors; Materials testing; Mobile handsets; Optical control; Optical materials; Optical sensors; Packaging; Production;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1319149

Filename

1319149