DocumentCode :
415877
Title :
Determination of the unknown coefficients in stress and flux conditions at fluid-porous interface
Author :
Min, Jung Yim ; Kim, Sung Jin
Author_Institution :
Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., South Korea
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
50
Abstract :
An innovative methodology is presented for the purpose of analyzing fluid flow and heat transfer in a porous/fluid composite system, where the porous medium is assumed to have a periodic structure, i.e., solid and fluid phases repeat themselves in a regular pattern. With the present method, analytical solutions for the velocity and temperature distributions are obtained when the distributions in the adjacent fluid layer are allowed to vary in the directions both parallel and perpendicular to the interface between the porous medium and the adjacent fluid layer. The analytical solutions are validated by comparing them with the corresponding numerical solutions for the case of the ideal composite channel, and with existing experimental data. The present analytical solutions have a distinctive advantage in that they do not involve any unknown coefficients resulting from the previous interfacial conditions. Moreover, by comparing interfacial conditions derived from the present study with the stress- and flux-jump conditions developed by previous investigators, the unknown coefficients included in the stress- and flux-jump conditions are analytically determined and are shown to depend on the porosity, the Darcy number and the pore diameter.
Keywords :
channel flow; composite material interfaces; flow simulation; flow through porous media; heat transfer; porosity; porous materials; temperature distribution; Darcy number; composite channel; fluid flow; fluid layer; fluid-porous interface; flux-jump conditions; heat transfer; periodic structure; porosity; porous medium; porous-fluid composite system; solid-fluid phases; stress-jump conditions; temperature distributions; Fluid flow; Heat engines; Heat transfer; Interconnected systems; Mechanical engineering; Pattern analysis; Space heating; Stress; Temperature distribution; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319153
Filename :
1319153
Link To Document :
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