Numerical Investigation of Enclosure Effects on Spot Cooling Devices

Heat sinks play a very important role in cooling of microelectronic devices. In particular, active heat sinks have been employed extensively to cool integrated circuit electronic devices and especially high power logic processors. An active heat sink has a miniature tubeaxial fan on to the top of a low profile heat sink. With its own fan, the active heat sink does not have to rely on the power supply fan for cooling the device. The performance of these devices has been documented both in journals and patents. In most computer systems, there is a considerable issue with adequate space for active heat sinks to perform optimally. Recently, Markell examined the effect of tightly enclosing a thermal heat sink in order to learn about arrangements and enclosure limits that strangle the ability of the heat sink to perform sufficiently. This examination was carried out experimentally by calculating the thermal resistance of a heat sink when placed in a variety of enclosures. In this paper, a "Numerical Investigation of Enclosure Effects on Spot Cooling Devices" is described. The model is a quarter model of a single channel with a fan. The mass flow rate in the outlet region of the fin and the flow exit region is displayed. Based on the findings, air flow blocking means was provided in order to redirect the flow and insure that appropriate air flow is provided to hot spot regions.