• DocumentCode
    415908
  • Title

    Influence coefficient method for calculating discrete heat source temperature on finite convectively cooled substrates

  • Author

    Muzychka, Y.S.

  • Author_Institution
    Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John´´s, Nfld., Canada
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    394
  • Abstract
    A simple method is developed for predicting discrete heat source temperatures on a finite convectively cooled substrate. The method is based on the principle of superposition using a single source solution for the mean or maximum contact temperature of an eccentric uniform heat source on a rectangular substrate. By means of influence coefficients, the effect of neighboring source strength and location may be assessed. It is shown that the influence coefficients represent localized thermal resistances, which must be weighted according to source strength. For a system of N heat sources, there exists N effects of source strength and position on any one heat source. This includes a self effect (source of interest) and N-1 influence effects (neighboring sources). The method is developed for isotropic, orthotropic, and compound systems. Convection in the source plane is addressed for isotropic and orthotropic systems. Expressions are developed for both mean and centroidal temperature.
  • Keywords
    convection; cooling; electronics packaging; temperature distribution; thermal resistance; centroidal temperature; compound system; contact temperature; discrete heat source temperature; eccentric uniform heat source; finite convectively cooled substrate; influence coefficient method; isotropic system; neighboring source strength; orthotropic system; self effect; single source solution; superposition principle; thermal resistance; Eigenvalues and eigenfunctions; Heat sinks; Noise measurement; Packaging; Resistance heating; Substrates; Surface resistance; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1319202
  • Filename
    1319202