DocumentCode :
415934
Title :
Professional development courses
Volume :
1
fYear :
2004
fDate :
1-4 June 2004
Keywords :
Bonding; Components, packaging, and manufacturing technology; Integrated circuit packaging; Laminates; Manufacturing processes; Material storage; Plastic packaging; Radio frequency; Semiconductor device packaging; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1319304
Filename :
1319304
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=415934
