Physical design of optoelectronic system-on-a-package using optical waveguide interconnects

Author

Seo, Chung-Seok ; Chatterjee, Abhijit ; Jokerst, Nan M.

Author_Institution

Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

29

Abstract

In this paper, we develop a computer-aided design (CAD) tool for physical design of optoelectronic system-on-a-package (SOP) using optical waveguide interconnects. The tool assigns the optimal location to modules and replaces long electrical interconnects with optical waveguide interconnects in order to maximize the overall performance of the optoelectronic system-on-a-package. More than 47% improvement in system-on-a-package performance is obtained through the use of optical waveguide interconnects.

Keywords

circuit layout CAD; integrated circuit packaging; integrated optoelectronics; optical interconnections; optical losses; optical planar waveguides; simulated annealing; area-driven optimized layout; bending loss; computer-aided design tool; embedded optoelectronics; interconnect-driven optimized layout; optical data path routing; optical waveguide interconnects; optical waveguide losses; optimal location to modules; optoelectronic system-on-a-package; physical design; simulated annealing; Design automation; Electromagnetic waveguides; High speed optical techniques; Optical crosstalk; Optical design; Optical interconnections; Optical losses; Optical surface waves; Optical waveguides; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319311

Filename

1319311