Measurement of deformation and strain in flip chip on BGA (FC-BGA)

Author

Kehoe, L. ; Guénebaut, V. ; Kelly, P.V.

Author_Institution

Opt. Metrol. Innovations Ltd, Cork, Ireland

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

120

Abstract

An autofocus digital image correlation (DIC) workstation, incorporating image stacking functionality was used to perform a thermo-mechanical deformation and strain analysis of controlled collapse chip connect (C4) bumps in two FC-BGA packages. Cross-sections through the C4 bumped region were analysed through a temperature cycle from ambient temperature up to 100°C. Strain concentrations at the C4 layer-to-die interface are revealed. Aspects of recent advances in digital image correlation technology are described in the context of this study.

Keywords

ball grid arrays; correlation methods; deformation; flip-chip devices; image processing; integrated circuit packaging; optical focusing; strain measurement; thermal stresses; 100 degC; C4 bump interconnect region; DIC workstation; FC-BGA; autofocus digital image correlation; controlled collapse chip connect bumps; deformation measurement; flip chip on BGA; image stacking; layer-to-die interface; strain concentrations; strain measurement; temperature cycling; thermal stress; thermo-mechanical deformation analysis; thermo-mechanical strain analysis; underfill material; Capacitive sensors; Digital images; Flip chip; Image analysis; Semiconductor device measurement; Stacking; Strain measurement; Temperature; Thermomechanical processes; Workstations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319324

Filename

1319324