Title :
A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding
Author :
Wu, Tzong-Lin ; Hung, Wen-Chi ; Lee, Chien-Hui ; Lin, Cheng-Wei ; Jou, Wern Shiarng ; Cheng, Wood-Hi
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
A high electromagnetic shielding, light weight, and low cost plastic package for a 2.5 Gbps optical transceiver module is developed by using a woven continuous carbon fiber (CCF) epoxy composite. The shielding effectiveness (SE) of the packaged optical transceiver modules is measured and theoretically modeled. By weaving the CCF in a balanced twill structure (BTS) with excellent conductive networks, the SE of the proposed package is significantly higher (about 20 dB) than a previous package using a liquid crystal polymer (LCP) composite. Besides better SE performance, the package is lower cost due to reduced usage of the carbon fiber. The proposed package for the optical transceiver module is suitable for use in low cost and low electromagnetic interference (EMI) lightwave transmission systems.
Keywords :
carbon fibre reinforced plastics; electromagnetic interference; electromagnetic shielding; modules; optical receivers; optical transmitters; plastic packaging; woven composites; 2.5 Gbit/s; EMI; carbon fiber epoxy composite; electromagnetic interference; electromagnetic shielding; low-cost plastic package; optical transceiver module; shielding effectiveness; woven balanced twill structure; woven continuous carbon fiber; Carbon dioxide; Costs; Electromagnetic interference; Electromagnetic measurements; Electromagnetic shielding; Liquid crystal polymers; Optical polymers; Plastic packaging; Transceivers; Weaving;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319337