A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding

Author

Wu, Tzong-Lin ; Hung, Wen-Chi ; Lee, Chien-Hui ; Lin, Cheng-Wei ; Jou, Wern Shiarng ; Cheng, Wood-Hi

Author_Institution

Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

199

Abstract

A high electromagnetic shielding, light weight, and low cost plastic package for a 2.5 Gbps optical transceiver module is developed by using a woven continuous carbon fiber (CCF) epoxy composite. The shielding effectiveness (SE) of the packaged optical transceiver modules is measured and theoretically modeled. By weaving the CCF in a balanced twill structure (BTS) with excellent conductive networks, the SE of the proposed package is significantly higher (about 20 dB) than a previous package using a liquid crystal polymer (LCP) composite. Besides better SE performance, the package is lower cost due to reduced usage of the carbon fiber. The proposed package for the optical transceiver module is suitable for use in low cost and low electromagnetic interference (EMI) lightwave transmission systems.

Keywords

carbon fibre reinforced plastics; electromagnetic interference; electromagnetic shielding; modules; optical receivers; optical transmitters; plastic packaging; woven composites; 2.5 Gbit/s; EMI; carbon fiber epoxy composite; electromagnetic interference; electromagnetic shielding; low-cost plastic package; optical transceiver module; shielding effectiveness; woven balanced twill structure; woven continuous carbon fiber; Carbon dioxide; Costs; Electromagnetic interference; Electromagnetic measurements; Electromagnetic shielding; Liquid crystal polymers; Optical polymers; Plastic packaging; Transceivers; Weaving;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319337

Filename

1319337