DocumentCode
415965
Title
Finite element analysis of passive electromagnetic devices including lumped electrical circuit models
Author
Wu, Hong ; Cangellaris, Andreas C.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
231
Abstract
A methodology is presented for the development of electromagnetically-accurate models for multipart interconnect structures and, in general, passive electromagnetic devices that include embedded lumped elements. The proposed methodology utilizes a discrete state-space model for the electromagnetic device, generated through the application of the finite element method for the spatial discretization of Maxwell´s curl equations. The incorporation of lumped resistors, inductors and capacitors is effected through the direct stamping of the state-space voltage-current relationship for these elements in the matrices of the generated state-space form of the discrete electromagnetic model. The conditions necessary for the discrete model to be passive are discussed. The proposed methodology is demonstrated and validated through its application for the generation of models for a system of two coupled microstrip lines.
Keywords
Maxwell equations; computational electromagnetics; coupled circuits; finite element analysis; interconnections; lumped parameter networks; microstrip lines; state-space methods; Maxwell curl equation spatial discretization; coupled microstrip lines; discrete state-space model; embedded lumped elements; finite element analysis; lumped capacitors; lumped electrical circuit models; lumped inductors; lumped resistors; multipart interconnect structures; passive electromagnetic device FEM; state-space voltage-current relationship; Capacitors; Electromagnetic analysis; Electromagnetic devices; Electromagnetic modeling; Finite element methods; Inductors; Integrated circuit interconnections; Maxwell equations; Resistors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319343
Filename
1319343
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