DocumentCode
415969
Title
Characterization of discrete decoupling capacitors for high-speed digital systems
Author
Kim, Joong-Ho ; Jiao, Dan ; He, Jiangqi ; Radhakrishnan, Kaladhar ; Dai, Changhong
Author_Institution
Intel Corp., Chandler, AZ, USA
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
259
Abstract
This paper describes frequency-dependent characterization of multi-terminal decoupling capacitors (2, 8, 14, and any arbitrary number of terminals) by using a full-wave tool developed at Intel. This tool can capture high frequency effects with fast CPU run time, which enables accurate modeling of the power delivery system. The full-wave S-parameters have been validated with the measurements and the modeled data obtained from a commercial tool (HFSS). Based on its fast and accurate solution, different design configurations of capacitors have been studied to identify the optimal configuration which maximizes the performance of the decoupling capacitor. To capture the frequency-dependent behavior of capacitor impedance, a higher order representation made up with 7 or 9 elements of RLGC was developed. This circuit representation was used to assess the accuracy of the conventional series lumped RLC capacitor model. Finally, the responses were incorporated into a high performance microprocessor power delivery network to investigate system performance.
Keywords
S-parameters; capacitors; equivalent circuits; optimisation; RLGC element model; S-parameters; capacitor impedance frequency-dependent behavior; capacitor optimization; discrete decoupling capacitor characterization; full-wave modeling tool; high frequency effects; high-speed digital systems; microprocessor power delivery system; multiterminal capacitor frequency-dependent characterization; series lumped RLC capacitor model; Capacitors; Digital systems; Frequency; Impedance; Load flow; Load flow analysis; Microprocessors; Power system modeling; RLC circuits; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319348
Filename
1319348
Link To Document