• DocumentCode
    415972
  • Title

    Performance of polymeric ultra-thin substrates for use as embedded capacitors: comparison of unfilled and filled systems with ferroelectric particles

  • Author

    Andresakis, John ; Yamamoto, Takuya ; Pramanik, Pranabes ; Biunno, Nick

  • Author_Institution
    Oak-Mitsui Technol., Hoosick Falls, NY, USA
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    289
  • Abstract
    We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this work, we have continued to characterize the performance and reliability of these materials. Additionally, customers have requested even higher capacitance values. We continue to work on making thinner dielectrics, and thus raise capacitance, but it is believed that loading the polymer with high dielectric (ferroelectric) particles can provide the best values for this type of capacitor. We examine the effect of loading the polymer with high Dk particles and compare the positive and negative aspects of using this filler. The results of our internal and external testing (and a comparison to existing and developing capacitor materials) helps determine what benefit(s), if any, a high speed system would get by using a high Dk filler polymer substrate.
  • Keywords
    barium compounds; copper; ferroelectric thin films; filled polymers; polymer films; printed circuits; substrates; thin film capacitors; Cu-BaTiO3; PCB embedded capacitor technology; PCB fabrication; copper foil; ferroelectric particles; filled polymers; high Dk particle filler; high dielectric particle loading polymers; polymeric ultra-thin substrates; thin dielectrics; unfilled polymers; Building materials; Capacitance; Capacitors; Conducting materials; Copper; Dielectric materials; Dielectric substrates; Dielectric thin films; Ferroelectric materials; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319353
  • Filename
    1319353