Manufacturability and reliability of different size wirebonds on different Al pad structures

Author

Sauter, Wolfgang ; Aoki, Toyohiro ; Hisada, Takashi ; Beaulieu, Frederic ; Allard, Stephanie ; Ostrowski, Kevin

Author_Institution

IBM Corp., Essex Junction, VT, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

352

Abstract

The manufacturability and reliability of wirebonds depends on many factors, most of which are linked to the BEOL wafer fabrication process. This paper presents a detailed experimental analysis of the effect of pad thickness and liner levels on the quality of the interconnection. Varying ball sizes are evaluated and compared for different target pitch applications. Thermal aging of the wirebonds with subsequent wire pull and ball shear was studied and the challenges of this test are described.

Keywords

ageing; aluminium; integrated circuit interconnections; integrated circuit reliability; lead bonding; shear strength; Al; BEOL wafer fabrication process; ball shear test; ball size; interconnection quality; pad liner levels; pad structures; pad thickness; thermal aging; wire pull test; wirebond manufacturability; wirebond reliability; wirebond size; Aluminum; Atherosclerosis; CMOS technology; Copper; Flip chip; Gold; Manufacturing processes; Performance evaluation; Semiconductor device manufacture; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319364

Filename

1319364