Failure analysis and virtual qualification of PBGA under multiple environmental loadings

Author

Qi, Haiyu ; Wilkinison, Chris ; Osterman, Michael ; Pecht, Michael

Author_Institution

CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

413

Abstract

To investigate the long term reliability of plastic ball grid array packages in aerospace applications, a design of experiments was conducted to address the assembly process, printed circuit board pad type, underfill, and multiple environmental loadings. This paper discusses the design of experiments and the test results, including the failure analysis. Virtual qualification was also performed to simulate the solder joint reliability under thermal cycling and vibration loadings.

Keywords

assembling; ball grid arrays; circuit simulation; design of experiments; encapsulation; failure analysis; integrated circuit packaging; integrated circuit reliability; plastic packaging; printed circuits; thermal stresses; vibrations; PBGA failure analysis; PBGA virtual qualification; aerospace applications; assembly process; design of experiments; multiple environmental loading; plastic ball grid array packages; printed circuit board pad type; solder joint reliability simulation; thermal cycling; underfill; vibration loading; Aerospace testing; Assembly; Circuit simulation; Circuit testing; Electronics packaging; Failure analysis; Plastic packaging; Printed circuits; Qualifications; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319373

Filename

1319373