DocumentCode
415994
Title
Power and reliability improvement of an electro-thermal microactuator using Ni-diamond nanocomposite
Author
Tsai, Li-Nuan ; Shen, Guang-Ren ; Cheng, Y.T. ; Hsu, Wensyang
Author_Institution
Dept. of Mech. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
472
Abstract
A low-temperature stress-free electrolytic nickel (EL) deposition process with the addition of uniformly dispersed diamond nanoparticles (diameter < 0.5 μm) is proposed to fabricate cantilevers and electro-thermal microactuators to demonstrate the improvement of the device on reducing input power requirement and enhancing operation reliability. The fabrication results show that the nanodiamond particles are successfully dispersed in the electroplating nickel layers. By calibrating the resonant frequencies of nickel cantilevers with different concentrations of diamond nanoparticles, the E/ρ ratio of cantilevers can be enhanced 7.1 times with diamond nanoparticles of 2 g/l in the proposed electrolytic nickel (EL) deposition process. From displacement tests, the electro-thermal microactuator with nanodiamond particles of 2 g/l reduces 73 % power requirement of pure nickel device needed at the same output displacement of 3 μm. Also, the reversible displacement range is found to be expanded from 1.8 μm to 3 μm by adding nanodiamond particles of 2 g/l in the nickel electro-thermal microactuators.
Keywords
Young´s modulus; diamond; electrodeposition; microactuators; nanocomposites; nanoparticles; nickel compounds; reliability; Ni-C; Ni-diamond nanocomposite; Youngs modulus; beam density; cantilevers fabrication; displacement tests; electro-thermal microactuator; enhanced operational reliability; low-temperature stress-free electrolytic nickel deposition process; power improvement; reduced input power requirement; reliability improvement; uniformly dispersed diamond nanoparticles; Fabrication; Inorganic materials; Microactuators; Micromachining; Nanoparticles; Nanoscale devices; Nickel; Structural beams; Temperature; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319381
Filename
1319381
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