Title :
Effects of the low loss polymers on the dielectric behavior of novel aluminum-filled high-k nano-composites [embedded capacitor applications]
Author :
Xu, Jianwen ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We report the innovative development of a low-cost high dielectric constant polymer-based composite that combines the advantages of polymer-ceramic and polymer-metal systems for embedded capacitor application. This novel material uses low cost self-passivated aluminum particles as the filler for the polymer composites. The thin self-passivated Al2O3 layer forms a nanoscale insulating boundary outside of the metallic spheres, which has dramatic influence on the electrical behavior of the resulting composites. The nanoscale insulating oxide layer allows the aluminum composites to have a high dielectric constant as a percolation system; on the other hand, the insulating oxide layer confines the electrons within an aluminum particle, thus keeping a very low loss of the composites. Details of both particle and polymer materials are given in this paper. This study may have a broad impact since it reveals a category of new dielectric composites filled by metal with either self-passivated or coated insulating boundary layers.
Keywords :
aluminium; aluminium compounds; capacitors; dielectric materials; filled polymers; insulating coatings; nanoparticles; passivation; percolation; permittivity; Al-Al2O3; aluminum-filled nanocomposites; coated insulating boundary layers; embedded capacitors; filler particles; high dielectric constant polymer-based composites; high-k nanocomposites; insulating oxide layer; low cost self-passivated aluminum particles; low loss polymers; metallic spheres; nanoscale insulating boundary; percolation system; thin self-passivated layer; Aluminum; Capacitors; Composite materials; Costs; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; High K dielectric materials; High-K gate dielectrics; Polymers;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319385