DocumentCode
416003
Title
Low temperature embedded capacitor fabrication
Author
Lok, Boon K. ; Lu, Albert Chee W ; Wai, Lai L. ; Fan, Wei ; Wong, Chee K. ; Wong, Kim H. ; Chee, M.C.
Author_Institution
Singapore Inst. of Manuf. Technol., Singapore
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
531
Abstract
Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications including filtering, tuning and power decoupling. This paper presents the performance characterization of two low temperature processes that are compatible with organic substrates. RF characterization up to 10 GHz was performed to extract the impedance profile, effective capacitance and capacitance density parameters.
Keywords
capacitance; circuit tuning; dielectric thin films; electron device testing; low-temperature techniques; microwave devices; printed circuits; radiofrequency filters; thin film capacitors; 10 GHz; RF characterization; capacitance density; component miniaturization; effective capacitance; electronics applications; filtering capacitors; impedance profile; integral passive technology; low temperature embedded capacitor fabrication; low temperature processes; mixed-signal integration; organic substrate compatible processes; performance characterization; power decoupling capacitors; product miniaturization; tuning capacitors; Capacitance; Capacitors; Dielectric materials; Dielectric substrates; Dielectric thin films; Fabrication; Frequency; Impedance; Temperature; Thin film circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319390
Filename
1319390
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