Power delivery system performance optimization of a printed circuit board with multiple microprocessors

Author

Mandhana, Om P. ; Zhao, Jin

Author_Institution

Somerset Design Center, Motorola Corp., Austin, TX, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

581

Abstract

An efficient simulation and analysis methodology for evaluating the power delivery system of a printed circuit board mounted with multiple microprocessors is presented in this paper. The methodology allows fast and accurate modeling of the physical multi-layer printed circuit board, package structures and frequency domain optimization for a noise free power delivery system from voltage regulator modules to multiple microprocessors. Based on network representations of the printed circuit board and the packages, an efficient computation of the input impedances and the effectiveness of different decoupling capacitor placements are studied. Different "what-if" analysis using a real printed circuit board as an example has been presented to demonstrate the effectiveness of the method.

Keywords

capacitors; circuit noise; circuit optimisation; circuit simulation; electric impedance; frequency-domain analysis; integrated circuit packaging; microprocessor chips; multichip modules; power supply circuits; printed circuit layout; voltage regulators; PCB power delivery system performance optimization; analysis methodology; decoupling capacitor placement effectiveness; frequency domain optimization; input impedances; multi-layer printed circuit board; multiple microprocessors; network representations; noise free power delivery system; package structures; power delivery system; simulation methodology; voltage regulator modules; Analytical models; Circuit noise; Circuit simulation; Frequency domain analysis; Microprocessors; Optimization methods; Packaging; Power system modeling; Printed circuits; System performance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319397

Filename

1319397