Title :
Reliability testing and data analysis of an 1657CCGA (ceramic column grid array) package with lead-free solder paste on lead-free PCBs (printed circuit boards)
Author :
Lau, John ; Daukshe, Walter ; Ott, Ed ; Shangguan, Dongkai ; Smetana, Joe ; Horsley, Rob ; Castello, Todd ; Love, Dave ; Menis, I. ; Sullivan, Bob
Author_Institution :
Agilent, Santa Clara, CA, USA
Abstract :
In this study, the thermal cycling test of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with HASL (hot-air solder leveling) CuSn, NiAu (electroless Ni and immersion Au, ENIG), and Entek OSP (organic solderability preservative) surface finishes are performed. The test stopped at 7500 cycles (0 to 100°C, 40-minute cycle). The test data is best fitted to the Weibull life distribution. Also, the sample mean, population mean, sample characteristic life, true characteristic life, sample Weibull slope, and true Weibull slope for the 1657CCGA package on the lead-free PCBs are provided and discussed. Furthermore, the relationship between the reliability and the confidence intervals for the life distribution is established. Finally, the confidence level for comparing the quality (mean life) of the CCGA solder joints is determined.
Keywords :
Weibull distribution; assembling; ceramic packaging; copper alloys; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; lead alloys; silver alloys; soldering; solders; statistical analysis; surface finishing; tin alloys; 0 to 100 C; 1657CCGA package; 40 min; CCGA solder joint quality; CuSn; CuSn surface finishes; Entek OSP surface finishes; HASL; Ni-Au; NiAu; NiAu surface finishes; SnAgCu; SnAgCu solder pastes; SnPb; SnPb solder pastes; Weibull life distribution; ceramic column grid array; confidence intervals; data analysis; electroless Ni immersion Au surface finishes; hot-air solder leveling; lead-free PCB; lead-free solder paste; life distribution; organic solderability preservative surface finishes; population mean; printed circuit boards; reliability; reliability testing; sample Weibull slope; sample characteristic life; sample mean; test cycles; test data fitting; thermal cycling test; true Weibull slope; true characteristic life; Ceramics; Circuit testing; Data analysis; Environmentally friendly manufacturing techniques; Gold; Lead; Packaging; Performance evaluation; Printed circuits; Surface finishing;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319417
