Packaging considerations for microelectromechanical microwave switches

Microelectromechanical switches for microwave signals offer better isolation, insertion loss and linearity than their solid-state counterparts. However, system issues such as packaging require examination. In previous work, we developed a shunt switch for controlling signals up to 20 GHz. These switches have been observed to be sensitive to the stresses typical to microwave packaging, resulting. in large increases in their actuation voltage during packaging. We therefore describe an alternative switch design that should be less sensitive to tensile stresses, which uses lateral actuation. This paper presents the performance of the bridge switches and the effects of stress and packaging on their performance. We also describe the design and fabrication of lateral switches, which rely on either electrostatic or thermal actuation.