Title :
Constitutive modeling of moulding compounds [electronic packaging applications]
Author :
Jansen, K.M.B. ; Wang, L. ; Yang, D.G. ; van´t Hof, C. ; Ernst, L.J. ; Bressers, H.J.L. ; Zhang, G.Q.
Author_Institution :
Delft Univ. of Technol., Netherlands
Abstract :
The virtual prototyping of electronic components requires reliable material models for all constituent materials. One of these materials is the moulding compound. This is an epoxy resin filled with inorganic (silica) particles, carbon black and processing aids. It shows a clear viscoelastic behaviour which is not only temperature but also cure dependent. This paper deals with the thermal and mechanical characterization and modeling of such moulding compounds with a focus on the effects of the degree of cure and the filler concentration.
Keywords :
curing; electronics packaging; filled polymers; glass transition; internal stresses; moulding; plastic packaging; thermal expansion; thermal stresses; viscoelasticity; C; SiO2; carbon black; cure dependent viscoelasticity; electronic component virtual prototyping; electronic packaging processes; filled epoxy resin; filler concentration; glass transition temperature; moulding compound constitutive modeling; residual stresses; silica particles; temperature dependent viscoelasticity; thermal analysis; thermal expansion; thermal stresses; Elasticity; Electronic packaging thermal management; Epoxy resins; Glass; Polymers; Residual stresses; Semiconductor materials; Silicon compounds; Thermal stresses; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319442
