Title :
Novel microstructuring technology for glass on silicon and glass-substrates
Author :
Mund, Dietrich ; Leib, Jürgen
Author_Institution :
SCHOTT Electron. Packaging GmbH, Landshut, Germany
Abstract :
Micro structuring glass (MSG) technology is an exciting new technology, that has the potential for solving demands in microelectronic and microfluidic applications including hermetic wafer level packaging. MSG offers the following advantages; chemical resistant borosilicate glass layers, layered structuring with photo resist and high glass deposition rates at low temperatures.
Keywords :
borosilicate glasses; hermetic seals; integrated circuit packaging; microfluidics; passivation; photolithography; photoresists; plasma CVD; MSG technology; PVD-PIAD; borosilicate glass layers; chemical resistance; glass on glass substrates; glass on silicon substrates; hermetic passivation; hermetic wafer level packaging; high glass deposition rates; layered structuring; low temperature deposition; mask-aligner lithography; microelectronics; microfluidics; microstructuring glass technology; photo resist; physical vapor deposition; plasma ion assisted deposition; Chemical technology; Glass; Leak detection; Nonhomogeneous media; Packaging; Plasma temperature; Resists; Silicon; Wafer bonding; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319450
