DocumentCode :
416059
Title :
Parallel optical interconnect at 10 Gb/s per channel
Author :
Simon, J. Onathan ; Windover, Lisa Buckman ; Rosenau, Steven ; Giboney, Kirk ; Law, Benjamin ; Flower, Graham ; Mirkarimi, Laura ; Grot, Annette ; Lin, Chao-Kun ; Tandon, Ashish ; Rankin, Glenn ; Gruhlke, Russell ; Dolfi, David
Author_Institution :
Agilent Labs., Agilent Technol. Inc., Palo Alto, CA, USA
Volume :
1
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1016
Abstract :
In many high-end systems, there is a growing need to replace copper interconnects with optical interconnects for link lengths up to 600 meters. 12-channel parallel-optical interconnects with each channel operating at a data rate up to 10 Gb/s are designed, assembled, and demonstrated. This is achieved using bottom-emitting 990-nm VCSELs and bottom-illuminated photodetectors (PDs) flip-chip bonded directly to 12-channel transmitter and receiver integrated circuits, respectively. Results show a 12-channel parallel-optical transmitter module operating at a data rate of 10 Gb/s per channel with all 12 channels operating simultaneously. In addition, a 12-channel parallel-optical receiver module with each channel operating at a data rate up to 10 Gb/s with all channels operating simultaneously is demonstrated. A BER <10-12 is measured on a single channel operating at a data rate of 10 Gb/s with all 12 channels operating simultaneously after transmission over 100 meters of 50-μm core standard multimode ribbon fiber.
Keywords :
error statistics; flip-chip devices; optical fibre communication; optical interconnections; optical receivers; optical transmitters; photodetectors; surface emitting lasers; 10 Gbit/s; 100 m; 50 micron; 600 m; 990 nm; BER; bottom-emitting VCSEL; bottom-illuminated photodetectors; flip-chip bonding; link length; multimode ribbon fiber; parallel optical interconnect; receiver IC; receiver module; transmitter IC; transmitter module; Assembly systems; Bonding; Copper; Integrated circuit interconnections; Optical design; Optical interconnections; Optical receivers; Optical transmitters; Photodetectors; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1319464
Filename :
1319464
Link To Document :
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