Silicon optical bench for high-speed optical subassemblies [optical receiver]

Author

Baks, Christian ; Schaub, Jeremy D. ; Doany, Fuad E. ; Furman, Bruce ; Rosner, Joanna ; Ishimura, Eitaro ; Masaharu, Nakaji

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

1029

Abstract

A passively aligned, flip-chip receiver optical subassembly (ROSA) was developed. The design features a silicon v-groove with a metallized reflector and a photodiode with an offset active area. This design minimizes the optical path length, allowing for much smaller photodetector areas than those used in previous designs. Excellent performance in terms of coupling efficiency, small signal bandwidth and 10 Gb/s eye diagrams for detectors as small as 20 μm in diameter are described. Mechanical features on the bench included special structures for optical underfill, fiber attachment and strain relief.

Keywords

elemental semiconductors; encapsulation; flip-chip devices; joining processes; optical fibre communication; optical receivers; photodiodes; silicon; 10 Gbit/s; 20 micron; ROSA; Si; eye diagrams; fiber attachment; flip-chip optical receiver; high-speed optical subassemblies; metallized reflector; offset active area photodiode; optical coupling efficiency; optical fiber communication; optical path length minimization; optical underfill; packaging; passively aligned optical subassembly; photodetector area requirements; receiver optical subassembly; silicon optical bench; silicon v-groove; small signal bandwidth; strain relief; Bandwidth; Detectors; High speed optical techniques; Metallization; Optical design; Optical fibers; Optical receivers; Photodetectors; Photodiodes; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319466

Filename

1319466