Flip-chip based 3-D high-Q integrated inductors

Solenoid type inductors have been realized using electroplating and flip chip packaging technology. The inductors were embedded in the package and are more reliable than the inductors built by MEMS techniques. The electromagnetic simulations have been performed to predict the inductors performances. The fabricated inductors achieved inductance ranging from 1nH to 2.5nH. The maximum Q factor is well above 15 even when the lossy silicon is at the both sides of the inductor.