Router flip chip packaging solution and reliability

In January 2000, the requirements and functional specifications for a family of high availability core routers were defined and drove the development of six custom VLSI devices using large FCCGA (flip chip column grid array) packages with large devices. Such combinations have always been a challenge for first level packaging as well as second level reliability. For this specific application, a 58 mm ceramic carrier with device sizes up to 21 mm required qualification and to be brought into production with high reliability performance. This paper describes the qualification strategy and structure used by the IBM flip chip assembly site located in Bromont (Quebec, Canada) as well as the test vehicle used to support end product reliability requirements. In addition, stress testing results are discussed, covering 1^st and 2^nd level packaging.