RF SiP: the next wave for wireless system integration

Author

Smolders, A. Bart ; Pulsford, Nick J. ; Philippe, Pascal ; Van Straten, Freek E.

Author_Institution

Philips Semicond., Nijmegen, Netherlands

fYear

2004

fDate

6-8 June 2004

Firstpage

233

Lastpage

236

Abstract

This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.

Keywords

Bluetooth; chip scale packaging; flip-chip devices; lead bonding; radiofrequency integrated circuits; thin film circuits; wireless LAN; Bluetooth radio; LAMP; RF SiP; WLAN 802.11b system; flip-chip technology; low-cost laminate platform; multiple active die placement; system-in-package concept; technology mixture optimization; thin-film passive integration IC technology; wire-bonding; wireless connectivity; wireless system integration; BiCMOS integrated circuits; CMOS technology; Costs; Gallium arsenide; Laminates; Lamps; Packaging; Radio frequency; Substrates; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE

ISSN

1529-2517

Print_ISBN

0-7803-8333-8

Type

conf

DOI

10.1109/RFIC.2004.1320581

Filename

1320581