MEMS SiGe technologies for advanced wireless communications

Author

Busquére, J.P. ; Do, N. ; Bougriha, F. ; Pons, P. ; Grenier, K. ; Dubuc, D. ; Boukabache, A. ; Schumache, H. ; Abele, P. ; Rydberg, A. ; Ojefors, E. ; Ancey, P. ; Bouche, G. ; Plana, R.

Author_Institution

Lab. d´´Autom. et d´´Anal. des Syst., CNRS, Toulouse, France

fYear

2004

fDate

6-8 June 2004

Firstpage

247

Lastpage

250

Abstract

This paper shows the potentialities of merging MEMS and micromachining with SiGe technologies in order to speed up the performance of the next generation of front ends, in term of flexibility, reconfigurability and adaptability. MEMS technologies are presented, based on BCB materials and BAW materials. Special attention is paid to ensure full compatibility between IC and MEMS. We have shown that very innovative functions could be considered by using this MEMSIC concept.

Keywords

Ge-Si alloys; electronics packaging; micromachining; micromechanical devices; radio equipment; radiofrequency integrated circuits; semiconductor materials; BAW materials; BCB materials; IC/MEMS compatibility; MEMS SiGe technologies; MEMSIC; SiGe; adaptability; flexibility; micromachining; reconfigurability; smart microsystems; wireless communications; wireless front ends; Germanium silicon alloys; Heterojunction bipolar transistors; Integrated circuit technology; Materials science and technology; Micromachining; Micromechanical devices; Radio frequency; Radiofrequency integrated circuits; Silicon germanium; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE

ISSN

1529-2517

Print_ISBN

0-7803-8333-8

Type

conf

DOI

10.1109/RFIC.2004.1320586

Filename

1320586