Title :
MEMS SiGe technologies for advanced wireless communications
Author :
Busquére, J.P. ; Do, N. ; Bougriha, F. ; Pons, P. ; Grenier, K. ; Dubuc, D. ; Boukabache, A. ; Schumache, H. ; Abele, P. ; Rydberg, A. ; Ojefors, E. ; Ancey, P. ; Bouche, G. ; Plana, R.
Author_Institution :
Lab. d´´Autom. et d´´Anal. des Syst., CNRS, Toulouse, France
Abstract :
This paper shows the potentialities of merging MEMS and micromachining with SiGe technologies in order to speed up the performance of the next generation of front ends, in term of flexibility, reconfigurability and adaptability. MEMS technologies are presented, based on BCB materials and BAW materials. Special attention is paid to ensure full compatibility between IC and MEMS. We have shown that very innovative functions could be considered by using this MEMSIC concept.
Keywords :
Ge-Si alloys; electronics packaging; micromachining; micromechanical devices; radio equipment; radiofrequency integrated circuits; semiconductor materials; BAW materials; BCB materials; IC/MEMS compatibility; MEMS SiGe technologies; MEMSIC; SiGe; adaptability; flexibility; micromachining; reconfigurability; smart microsystems; wireless communications; wireless front ends; Germanium silicon alloys; Heterojunction bipolar transistors; Integrated circuit technology; Materials science and technology; Micromachining; Micromechanical devices; Radio frequency; Radiofrequency integrated circuits; Silicon germanium; Wireless communication;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
Print_ISBN :
0-7803-8333-8
DOI :
10.1109/RFIC.2004.1320586
