DocumentCode
418064
Title
RF robustness enhancement through statistical analysis of chip package co-design
Author
Duo, Xinzhong ; Zheng, Li-Rong ; Tenhunen, Hannu
Author_Institution
Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Stockholm, Sweden
Volume
1
fYear
2004
fDate
23-26 May 2004
Abstract
In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs on SoP module were also analyzed in terms of performance and yield. The design methods were demonstrated through case studies of LNA (low noise amplifier) in SoP.
Keywords
chip scale packaging; integrated circuit yield; multichip modules; RF circuits; RF modules; RF robustness enhancement; RF system-on-package; SoP module; chip package co-design; low noise amplifier; off-chip passive components; on-chip passive components; statistical analysis; Circuit analysis; Conducting materials; Costs; Design optimization; Manufacturing processes; Performance analysis; Radio frequency; Robustness; Statistical analysis; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN
0-7803-8251-X
Type
conf
DOI
10.1109/ISCAS.2004.1328363
Filename
1328363
Link To Document