• DocumentCode
    418506
  • Title

    Decoupling technique and crosstalk analysis for coupled RLC interconnects

  • Author

    Zhang, Junmou ; Friedman, Eby G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    23-26 May 2004
  • Abstract
    With lower wire resistance and faster signal rise times, the on-chip inductance plays an important role in determining the circuit performance and signal integrity characteristics. The self and mutual inductance must be considered in the analysis of crosstalk noise between coupled RLC interconnects. Based on the ABCD parameter matrix, a decoupling technique for two coupled identical RLC interconnects is developed. The inductances (capacitances) of two decoupled interconnects are the effective inductances (capacitances) when both inputs switch in the same and inverse direction, respectively. A model of the peak crosstalk noise is developed based on this decoupling technique, with the peak noise occurring at the time of flight tfmax or 3tfmax. The model exhibits an average error of 6.8% as compared to SPICE. The peak crosstalk noise does not necessarily increase with greater coupling inductance or capacitance. The decoupling technique is further extended to two non-identical coupled interconnects, providing an upper limit on the peak crosstalk noise.
  • Keywords
    RLC circuits; capacitance; coupled circuits; crosstalk; error analysis; inductance; integrated circuit interconnections; integrated circuit noise; system-on-chip; time of flight spectra; circuit performance; coupled RLC interconnect; coupling capacitance; coupling inductance; crosstalk noise analysis; decoupling; effective inductance; flight time; lower wire resistance; matrix parameter; mutual inductance; on chip inductance; peak crosstalk noise; self inductance; signal integrity properties; Capacitance; Circuit optimization; Coupling circuits; Crosstalk; Inductance; Integrated circuit interconnections; Mutual coupling; SPICE; Switches; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
  • Print_ISBN
    0-7803-8251-X
  • Type

    conf

  • DOI
    10.1109/ISCAS.2004.1329323
  • Filename
    1329323