Title :
The frequency-dependent average power handling capability of metal-insulator-semiconductor (MIS) microstrip interconnects
Author :
Yin, Wen-Yan ; Dong, Xiaoting ; Beng Gan, Yeow
Author_Institution :
Temasek Labs., Nat. Univ. of Singapore, Singapore
Abstract :
The average power handling capabilities (APHC) of various metal-insulator-semiconductor (MIS) microstrip configurations are studied and compared. The methodology is based on the accurately extracted conductive and substrate attenuation constants, and proposed thermal models to predict the rise in temperature, where the silicon substrate is characterized by an effective thickness determined by the complex image method. Numerical results are given to show the effects of strip thickness and width, silicon conductivity, isolation thickness, etc., on the APHC of different MIS microstrip interconnects. Approaches to enhance the APHC effectively are also indicated.
Keywords :
MIS devices; integrated circuit interconnections; microstrip lines; silicon; temperature; thermal analysis; MIS microstrip interconnects; Si; complex image method; conductive constants; frequency-dependent average power handling capability; isolation thickness; metal-insulator-semiconductor microstrip interconnects; silicon conductivity; silicon substrate; strip thickness; strip width; substrate attenuation constants; temperature rise; thermal models; Dielectric losses; Equations; Frequency; Insulation; Integrated circuit interconnections; Metal-insulator structures; Microstrip; Silicon; Temperature; Thermal conductivity;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
DOI :
10.1109/APS.2004.1329834
